Optomec Receives $2 Million Order for Electronic 3D Printers
ALBUQUERQUE, NM – Optomec Inc. announced that one of its existing production customers recently purchased six more Aerosol Jet 3D electronic printers, bringing its total number to 20 systems.
Orders over $2 million are part of a production ramp plan that will grow to more than 30 systems over the next 12 months.
These latest orders include the first customer installations of Optomec’s new HD2 printer for 3D additive electronics, a platform designed for in-line production in advanced semiconductor packaging and assembly operations. of PCBs. Additionally, as part of the contract, Optomec will provide production recipes for the conductive and insulating materials.
The customer is one of the world’s leading manufacturers of aerospace and defense electronic systems and other advanced technology products with over $25 billion in annual sales. They have been using Optomec’s patented Aerosol Jet 3D printed electronic solution for over five years.
“Optomec is fortunate that many of its customers are at the forefront of adopting additive manufacturing in real-world production applications,” said David Ramahi, CEO of Optomec. 3D additive electronics, having shipped hundreds of thousands of products manufactured using Optomec’s Aerosol Jet solution for advanced semiconductor packaging.
Semiconductor packaging examples showing 3D printed interconnects for 3D stacked chip (l), mmWave (c), and flex circuit (r).
Optomec’s patented Aerosol Jet 3D electronic printers are a unique additive electronics solution capable of directly printing high-resolution conductive circuits with feature sizes as small as 10 microns. The process is further differentiated by its ability to print on non-planar substrates and fully 3D end pieces. Production applications include direct printing of 3D antennas, 3D sensors, medical electronics, semiconductor packaging and display assembly.
3D printing interconnects to connect chips to other chips, traditional printed circuit boards, and even directly integrated into end products, such as wearable devices, is one of the major high-speed use cases. added value in semiconductor packaging. In this case, the method replaces the old wiring by wire because of its advantages in terms of less bulk, less loss (especially in high frequency and millimeter waves) and greater mechanical reliability.